MYDATA exhibits new MY200 pick-and-place machine at IPC APEX 2014

 At APEX 2014 in Las Vegas, MYDATA will introduce to the North American   market its new MY200 placement machine, delivering twice the accuracy and higher   throughput.

 

 Citing a growing need to handle varying batch sizes and increasingly   complex components at all levels of the SMT industry, MYDATA says it will   introduce to the North American market a higher speed pick-and-place platform at   the forthcoming IPC APEX 2014 trade show. The new solution is part of the   company’s vision of accelerating success for its customers with a range of   versatile SMT solutions for increasingly complex electronics production   environments.

 Reducing inventories

 

As we pull out of a global recession, we see demand picking up but many of   our customers are still very sensitive about keeping inventories and labor costs   low,” says Robert G?thner, General Manager Business Area SMT at Micronic Mydata.   “This caution is fueling an interest in new types of printing, placement and   storage solutions that optimize line utilization, expand component handling   capabilities and keep inventory and staffing to a minimum.”

 

 High-performance pick-and-place

 

  With this in mind, the company is presenting its latest technology   platform at the IPC APEX show in Las Vegas, Nevada from March 25 ?C 27 (Booth   670). “We’re very happy to have the new MY200 on hand at APEX to let our   customers have a first-hand look at how this platform can boost productivity in   the most demanding production environments,” says Brian Duffey, President of   MYDATA automation Inc., headquartered in Boston. According to Mr. Duffey, the   MY200 is already generating interest and sales in the Americas following its   global introduction at the Productronica show in Europe.

 

Handling complex components - at higher speeds

 

“In the US market, the MY200’s ability to handle a wider range of components   at high speed is a welcome improvement. We see a growing need to mount diverse   components with uncompromising accuracy as content in electronic devices becomes   increasingly varied and complex,” explains Duffey. The MY200 can now achieve   high-speed placements of chip components below 30 micrometers with 3-sigma   repeatability, representing a doubling in accuracy compared with previous   platforms. An added benefit is an improved angular accuracy, making it possible   to mount ultra-fine pitch QFPs or 0.4 mm BGAs according to IPC class 2   workmanship standards - at high speed. This is enabled by new and highly   advanced hardware and software features that give electronics manufacturers   higher throughput, accuracy and line utilization.

 

High-mix thinking for higher volume challenges

 

In addition to the MY200 series, MYDATA will also exhibit a wide range of   industry-leading solutions that bring the company’s high-mix expertise to a   broader base of higher volume manufacturers. These include the company’s   pioneering solder paste jet printing platform, fully automated storage solutions   and advanced software systems for the modern SMT factory. Duffey notes that   demand has grown for jet printing in particular as growing number of consumer   electronics manufacturers are now recognizing its ability to achieve superior   solder joints in a wide variety of higher volume applications.

 

 Visit the MYDATA booth at APEX 2014

“Our aim is to provide complete   solutions that boost the productivity of customers in today’s increasingly   varied production landscape,” concludes G?thner. He warmly invites the press,   customers and interested parties to stop by Booth 670 at IPC APEX in Las Vegas,   Nevada from March 25 - 27.

 

Micronic Mydata AB (publ) is listed on NASDAQ OMX, Stockholm, Small Cap:   MICR.