2019-12-28 Type of vacuum heat treatmentVacuum annealing: eliminate and reduce the heterogeneity of tissue, remove internal stress and improve its plasticity.Vacuum tempering: eliminates internal stress during machining.Vacuum quenching :(gas quenching, oil quenching) fast cooling after heating to harden the m
Read More 2019-12-28 To solve the problem of liquid cooling when 3D chips stack, the defense advanced research projects agency (DARPA), in collaboration with IBM and the Georgia institute of technology, has developed an in-chip/inter-chip enhanced cooling program that USES an insulating dielectric refrigerant (instead o
Read More 2019-12-27 This paper respectively from the IGBT chip structure, the structure of the collector area on the back and front MOS structure, the system analyzes the technology present situation and the characteristics of high power IGBT chip, from two aspects of chip welding and the electrode interconnection comp
Read More 2019-12-27 With the development of semiconductor chip technology and optical technology, the output power of semiconductor lasers has been continuously improved, the beam quality has been significantly improved, and more applications have been obtained in the industrial field.At present, the output power and b
Read More 2019-12-26 UVA(405-315nm) : ink printing, electronic PCB, floor paint, decoration, home appliances, optical fiber, automobile, ore identification, stage decoration, banknote inspection, etc.UVA light curing principle: add light initiator in a specially formulated resin (or photosensitizer), after absorption in
Read More 2019-12-26 In recent years the rapid development of the panel industry, after the domestic manufacturers crazy expansion, the product supply and demand relationship has been basically relaxed, manufacturers began to focus on the product "quality" to improve.The display panel industry is moving toward high-reso
Read More 2019-12-24 1.Working principle:Vacuum sintering is a process of forming (finished and semi-finished) powder and block materials.The basic process is: the sintered material (powder or block) is placed in the vacuum furnace, the door is closed and the furnace is vacuumized.The furnace vacuum is pumped to the req
Read More 2019-12-24 Toshiba is building high-level flash memory and ReRAM chips, and prototype samples are expected to be launched next year.The idea of a high-rise or 3D chip is that we can bypass the limitations of the increased density of flash or memory chips and stack them up to increase the storage density, just
Read More 2019-12-23 Principle of operation brazing is the use of a material with a lower melting point than the base metal as the filler when two materials of the same or different properties are connected.When the connected part and the filler are heated to the point where the filler melts, the liquid filler is used t
Read More 2019-12-21 In the application of vacuum system, the extracted gas not only includes the various gases generated in the application process, but also includes the original atmosphere and air in the system, etc., then, what are the total?1. Some gases generated in the process of vacuum systemIt includes the gase
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