DB200 is a high-precision die bonding machine that can mount various components and chips through a vacuum nozzle, meeting the high-precision mounting requirements of bare chips, electronic components and IC components. This product is suitable for precision mounting of various ICs such as SMD chip components 01005, 0201, 0402, SOIC, PLCC, QFP, BGA, etc. Configuring high-precision visual centering system,It can meet the mounting requirements of QFP and BGA chips at high-precision 0.4mm pin spacing.
DB200 adopts a marble structure. The bottom platform and Y-axis gantry structure are all made of marble. Effectively ensure the reliability and stability of the surface mount machine for long-term use.
The die bonding machine adopts a high-definition industrial camera to complete the visual alignment and mounting of high-precision components.
Configuring a visual MARK camera, it can automatically recognize MARK points, effectively improve the mounting accuracy of the surface mount machine.
R&D personnel can choose semi-automatic mode to operate the movement and various actions of each axis through software, achieving high-precision mounting effect.
Standard configuration: 3 sets of visual alignment systems, 5 suction nozzles and a feeder chassis that can hold 23 8MM feeders.
The transmission for the entire machine is achieved by using servo motors combined with high-precision ball screws, which can complete the repeated installation of high-precision components.
Configuring different feeders, it can meet the mounting requirements of components of different sizes.
CAD data of the substrate or universal coordinate data in TXT format can be imported.
The programming and mounting of substrate assembly can be processed.
An optional eutectic platform can be used to achieve high-precision eutectic mounting.
An optional dispensing system can be selected to achieve both dispensing and surface mounting functions, allowing for one machine to be used for two purposes.
Both heat curing and UV curing functions can be equipped to realize process oriented sampling of R&D products.
The flip chip function can be optionally selected to achieve flip chip mounting.
The feeding can support feeding methods such as strip feeding, short strip feeding, waffle box feeding, ICtray feeding, etc.
Two sets of bottom cameras are equipped, which achieves precise mounting of minimum 01005 components and 25 * 25mm chips through high-precision algorithms.
[标配]
1. 1 industrial computer
2. 1 group of mounting heads
3. 6 suction nozzles
4. 2 sets of GFTA-23 feeder platforms
5. 2 sets MARK point recognition cameras
6. 1 set QFP precision industrial camera
7. 1 set QFP high-definition light source system
8. IC tray
9. I waffle box feeding device
[选配]
1. 8mm, 12mm, 16mm, and 24mm automatic feeders
2. Eutectic platform
3. Flip-chip system
4. Mounting head pressure programmable control system
5. AQ38 bottom mirror system (can be mounted with 25MM-38MM QFP)
6. Glue dispensing function
7. Adhesive thermal curing device
8. Adhesive UV curing device
9. Short strip feeding device
