1. The equipment consist 3 or 4 zones, 3 zones contains 3 independent process chambers for preheating, soldering, and cooling; 4 zones is equipped with two preheating and soldering and cooling chambers, all of which are equipped with observation windows, and
the process pressure is maintained at 20-200Pa. 2. Support nitrogen and formic acid (nitrogen+formic acid) atmosphere environment and
can be precisely controlled; Support solder preform process. 3. Programmable multi-stage vacuum pumping function: Each chamber has an
independent vacuum pump and control system, with a vacuum of ≤ 20Pa and a pumping speed of 200m ^ 3/h. It is equipped with a soft pumping valve and the speed can be
adjusted. The vacuum value of the chamber is displayed in real-time and can be controlled and adjusted.
4. 4.The heating plate adopts a contact type metal heating plate, and the cooling plate adopts a contact type heat dissipation. High temperature stability of metal heating plates: Metal heating plates have large thermal energy storage, which can store and release a large
amount of heat during the heating process, effectively buffering temperature fluctuations and making the temperature inside the furnace more stable.
5. The working temperature is around 400 ℃, the temperature control accuracy is ≤± 0.5 ℃, the temperature uniformity is ≤± 1%, and the oxygen content is below 0.5PPM.
6. After soldering, the individual void rate is less than 1%, and the total void rate does not exceed 3% (10 * 10mm or more). The process curve can be adjusted according to specific
requirements; The displacement of the chip after soldering soldering fixtures meets the process requirements (displacement ≤ 0.2mm, angle ≤ 1 degree).
7. Process control: 1) The temperature gradient and time at each stage of soldering can be freely programmed and saved as needed; 2) Capable of automatically generating all
process curves and editing process programs; 3) Equipped with a digital gas mass flow controller (MFC), it can accurately control the process gas flow rate.
8. Independently developed control program, capable of real-time monitoring and data recording, displaying and recording temperature, flow rate, and vacuum data in real-time;
Capable of program permission management (administrators, technicians, and operators) to prevent program parameters from being mistakenly modified.
9. Equipped with chamber leakage alarm (alarm when vacuum failure is detected and gas leakage occurs), gas supply pressure alarm (alarm when gas pressure is too low), chamber
overpressure alarm (alarm when chamber pressure is too high), formic acid level alarm (alarm when formic acid level is too low), and overtemperature alarm (alarm when
temperature exceeds the set temperature); Equipped with an independent gas protection system, all electrical doors are equipped with locking devices.
10. The temperature control system has intelligent temperature correction function, which can compensate for temperature differences; Equipped with MES functionality, it can open
corresponding interfaces and functions to obtain the information required by customers, following the SEMI communication standard SECS/GEM.
11. There are track interfaces at the front and back, which can be docked with the surface mount machine through the track.
12. Modular design of equipment, patented design of heating tubes. If there is a change in temperature uniformity during long-term use, it is not necessary to replace the entireheating plate. Instead, some heating tubes can be replaced directly. Convenient to adjust the temperature uniformity of each heating plate,easy to maintain and calibrate temperaure performance
