1、The furnace has three zones, namely preheating zone, heating zone, and cooling zone (with independent process chambers); Each chamber is equipped with an observation window, and the process chamber pressure ranges from 0.2 to 1050mbar.
2、The furnace supports nitrogen and formic acid (nitrogen+formic acid) atmosphere inert gas supply lines and these inert gases can be precisely controlled;the furnace supports soldering preform process.
3、Multi-stage vacuumizing is programmable: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum degree of ≤ 1mbar and a pumping speed of 100m ^ 3/h. It is equipped with a soft pumping valve and the speed can be adjusted. The vacuum value of the chamber is displayed in real-time and can be controlled and adjusted.
4、Adopting heating plate contact for heating and cooling plate contact for heat dissipation,the area of the heating plate and cooling plate is 280 * 310mm, and the load-bearing capacity of the heating plate compartment is ≤ 20 kg; Heating rate ≤ 3 ℃/s,the heating rate is continuously adjustable , cooling rate 3-6 ℃/s and cooling rate is continuously adjustable The heating rate and cooling rate can be programmed and controlled.
5、The working temperature is around 400 ℃, with a temperature control accuracy of ≤± 0.5 ℃ and a temperature uniformity of ≤± 1%.
6、After soldering, the individual void rate is less than 1% of the chip area, and the total void rate does not exceed 3% (10 * 10mm or more). The process curve can be adjusted according to specific requirements; The displacement of the chip after soldering without fixtures meets the process requirements (displacement ≤ 0.2mm, angle ≤ 1Degree).
7、Process control: 1) The temperature gradient and duration time at each stage of soldering can be freely programmed and saved as needed;
2) Capable of automatically generating all process curves and editing process programs;
3) Equipped with a digital gas mass flow controller (MFC), it can accurately control the process gas flow rate.
8、Independently developed control program,it is capable of real-time monitoring and data recording, displaying and recording temperature, flow rate, and vacuum data in real-time; Capable of program permission management (administrators, technicians, and operators) to prevent program parameters from being mistakenly modified.
9、The furnace is equipped with chamber leakage alarm (alarm when vacuum failure is detected and gas leakage occurs), gas supply pressure alarm (alarm when gas pressure is too low), chamber over-pressure alarm (alarm when chamber pressure is too high), formic acid level alarm (alarm when formic acid level is too low),Over-temperature alarm (alarm when the temperature exceeds the set temperature); Equipped with an independent gas protection system, all electrical doors are equipped with locking devices.
10、The average lifespan (flatness) of the heating plate is over 5 years, and the temperature control system has an intelligent temperature correction function that can compensate for temperature differences; Equipped with MES functionality, it can open corresponding interfaces and functions to obtain customer required information,the SEMI is in accord to SEMI communication standards SECS/GEM。
11、 There are track interfaces at the front and back, which can be docked with the surface mount machine through the track.
12. With modular design of furnace, separate design of heating elements and heating plates, the heating elements of the furnace can be replaced directly.
It is not necessary to replace the entire heating plate if there is a change in temperature uniformity during long-term use. It is convenient to adjust the temperature uniformity of each heating plate and it is easy to maintain and calibrate of temperature performance.
