1.Soldering temperature: 450℃, ( 600℃is optional )
2.Vacuum: Ultimate vacuum ≤ 5 × 10-2 torr.
3. Positive pressure capacity: 0.5Mpa (1Mpa optional)
4.Effective soldering area: ≤ 280mm * 280mm
5.Furnace inner diameter/height: inner diameter 480mm, height ≥ 65mm (120MM/220mm height optional)
6.Heating methods: Use bottom infrared radiation heating, and the heating plate adopts a silicon carbide platform. The silicon carbide platform is not easily deformed after long-term use and has high thermal conductivity, making the surface temperature of the hot plate more uniform.
7.Temperature uniformity: Within the effective soldering area, it is ≤± 1%. The heating platform doesn’t have cooling pipes inserted, resulting in higher temperature uniformity.
8.Heating rate: Maximum 120 ℃/min.
9.Cooling rate: Maximum 120 ℃/min.(Within range of no-load maximum temperature -150 ℃). Silicon carbide heating platform: adopts a combination of air cooling and water cooling to achieve rapid cooling of the heating plate, improve the cooling rate, and achieve poor sintering of the device due to excessive temperature difference during the cooling process.
10.Meet the soldering requirements of various types of solder materials (≤450 ℃). Especially when sintering nano silver materials that meet moderate positive pressure requirements.
11.Void rate: VPO300 has been verified by a large number of customers during soldering with soft solder, and the porosity can be controlled under 2%.
12.Optional high positive pressure module: The equipment can be equipped with a positive pressure module ≤ 1Mpa, which can meet the requirements of positive and negative pressure processes. Positive pressure technology can effectively solve the problem of displacement of small devices during the soldering process, while also effectively improving the metal density of the solder.
13.Temperature control system and temperature measurement system
13.1VPO300 adopts advanced temperature control technology, with a temperature control accuracy of ± 1 ℃.
13.2VPO300 curves can be set up to 40 temperature segments, and equipped with 6 sets of PID settings for more accurate temperature control, ensuring soldering consistency and reliability. Temperature control belongs to lag control, while PID control has the function of leading adjustment, which can improve the precision and stability of temperature control.
13.3VPO300 is equipped with two sets of temperature measuring thermocouples as standard in the chamber. The equipment can provide real-time feedback to the chamber during operation. It also is equipped with two sets of temperature measuring thermocouples as standard in the chamber, and can provide real-time feedback to the chamber system during operation, providing support for achieving good process curves.
14.Chamber atmosphere environment
VPO300 can be filled with nitrogen inert gas to assist soldering, while meeting the reducing atmosphere process of formic acid and nitrogen hydrogen mixed gas (5% hydrogen and 95% nitrogen). The process atmosphere can be precisely controlled by time or MFC mass flow meter to ensure consistency in completing each set process. soldering under the condition of helpless flux is also supported.
15.VPO300 software control system:
15.1The software control system is based on the Windows operating system and is easy to operate.
15.2By programming the process conditions such as temperature, time, pressure, and vacuum, the software process automatically controls the entire process.
15.3The process curve programming has an infinite number of process actions to meet complex process requirements.
15.4The control system meets various soldering process curves (with 5 preset processes) and can be set, modified, stored (computer storage, unlimited quantity), and called according to different processes.
15.5The control system comes with an analysis function, which can analyze the process curve and determine information such as temperature rise, constant temperature, and temperature drop.
15.6The software control system automatically records the soldering process, temperature control, and temperature measurement curves in real-time, ensuring the traceability of the device process, and automatically stores them in the corresponding directory according to the process working time.
15.7Adopting a fully automatic closed chhamber structure to ensure long-term reliability, the automatic closure of the upper cover during use will not cause device displacement, avoiding device vibration affecting soldering quality. The single chamber process meets both heating and cooling requirements simultaneously.
16.The upper cover automatically lifts and rotates (lifting height ≥ 10mm, rotation angle ≥ 150 degrees). Except for manual picking and placing of parts, other operation software automatically controls the completion. The height of the workbench is about 880mm ± 50mm.
17.The heating plate is made of pure material and does not have any additional structures such as cold water pipes, resulting in a more uniform temperature.
18.VPO300 cooling method adopts the sixth generation water cooling technology of TORCH. During heating, water cooling does not affect the temperature uniformity of the thermal field. During cooling, the heating plate and water cooling system are precisely matched to achieve rapid water cooling, and the temperature uniformity is higher during cooling. Especially suitable for higher quality packaging soldering, such as packaging soldering of silicon carbide chips.
