The DS series vacuum reflow oven is a professional small vacuum soldering furnace used in small space environments. The DS series uses a metal heating rod to penetrate the heating platform for heating. During heating, the platform rises and separates from the bottom of the chamber. After heating, the platform descends and adheres to the bottom of the chamber, and the corresponding bottom of the chamber is always in a water cooling state. After the platform adheres to the bottom of the chamber, it can achieve rapid cooling effect.
Soldering temperature: The actual maximum soldering temperature ≤ 400 ℃.
Effective soldering area: ≤ 110mm * 110mm. Chamber height: ≤ 40mm.
Vacuum ≤ 1Pa.
Heating method: A metal heating rod is inserted into the heating platform for heating. The heating platform adopts a semiconductor grade graphite coated silicon carbide platform, which is not easily deformed after long-term use and has high thermal conductivity, making the surface temperature of the platform more uniform.
Temperature uniformity: Within the effective soldering area ≤± 2%.
Heating rate: ≤ 120 ℃/Min, cooling rate: ≤ 60-120 ℃/Min.
Temperature control system and temperature measurement system: DS110 adopts advanced temperature control technology, with a temperature control accuracy of ± 1 ℃. The temperature curve can be set up to 40 temperature segments and configured with3 sets of PID settings for more precise temperature control, ensuring soldering consistency and reliability. Temperature control belongs to lag control, while PID control has the function of leading adjustment, which can improve the precision and stability of temperature control. Two sets of temperature measuring thermocouples are standard in the chamber, which can provide real-time feedback on the temperature at any position inside the chamber and display the temperature curve in real-time in the software, better ensuring temperature control in the soldering area and providing support for achieving good process curves.
Chamber atmosphere environment: Nitrogen (inert gas) is filled to assist soldering, and the process atmosphere can be precisely controlled by time and float flowmeter to ensure consistency in completing each set process and meet the soldering requirements without flux.
DS110 software control system: The software control system is based on the Windows operating system and is easy to operate. It can be programmed through process conditions such as temperature, time, pressure, and vacuum, and the software process automatically controls the entire process. The process curve programming has an infinite number of process actions to meet complex process requirements. The control system meets various soldering process curves and is set, modified, stored, and called according to different processes. The control system comes with an analysis function, which can analyze the process curve and determine information such as temperature rise, constant temperature, and temperature drop. The software control system automatically records the soldering process, temperature control, and temperature measurement curves in real time, ensuring the traceability of the device process, and automatically stores them in the corresponding directory according to the process working time.
DS110 adopts a closed cavity structure to ensure long-term reliability. The single chamber process meets both heating and cooling requirements simultaneously.
The DS110 has a window on the top cover, which allows for observation of the device soldering process through a microscope.
The DS110 heating platform has structures such as cold water pipes, making the temperature more uniform.
The DS110 cooling method adopts flat bonding cold water technology, and the water cooling during heating does not affect the temperature uniformity of the heating platform, resulting in high cooling efficiency.
