TCB350 thermal compression bonder
TCB thermal compression bonder is an evolution of the standard flip chip
process, mainly completing the process of hot press bonding of die to wafer,
die to PCBs and other substrates. At present, TCB350 has achieved thermal
compression bonding of large-sized (50/70mm) bare die. The maximum size
of the substrate vacuum adsorption heating device can achieve 300mm *
300mm.
