DB80H is a manual high-precision die bonding machine. The whole machine adopts a
precision motion platform to ensure that the entire motion accuracy meets the
requirements of mounting accuracy. Optional configuration includes nozzle pressure
feedback system for pressure mounting, Optional nozzle heating system for eutectic
mounting, optional dispensing system to achieve dispensing and mounting.
The SMT accuracy of this system can reach 5um according to different configurations,
and the suction nozzle can be manually replaced according to different sizes of chips.
It is an essential equipment for high-precision adhesive bonding of high-end medical
equipment (core imaging module assembly), optical components (laser LD palladium
bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor chips (MEMS
components, RF components, microwave components, and hybrid circuits). It is very
suitable for the research and development needs of research institutes, military units,
universities, and other research institutions, as well as enterprise laboratories for
small-scale and multi variety production. This machine has high precision, stable
performance, and high cost-effectiveness. The operation is very convenient, especially
suitable for high-precision chip assembly.
Mounting system
Visual calibration system
(Systematic inspection and calibration of
the accuracy of the mounted chips)
Mounting platform
vacuum system
High precision visual alignment system
Top nozzle heating module
Suction nozzle pressure feedback system
Nitrogen protection gas module
Substrate preheating module
Eutectic platform
Flip chip module
