The DS series vacuum eutectic furnace is the 3rd generation of small vacuum eutectic furnace equipment launched by TORCH. The small vacuum eutectic furnace equipment designed specifically
for small-scale production, R&D, functional material testing, and other applications. The DS series vacuum eutectic furnace heats up in a vacuum environment to achieve no void solder joints, fully
meeting the testing and small-scale production requirements of the R&D department. The DS series vacuum eutectic furnace can achieve 2% void rate during the soldering area, while the range of
ordinary eutectic furnaces is 20% to 30%. The DS series vacuum eutectic furnace can be used for flux free soldering, without void solder joints, and can be used in various atmospheres such as N2, N2/H2,
95%/5%.
The DS series vacuum eutectic furnace can use lead-free solder paste or solder pad technology, as well as the non solder flux technology. The DS series vacuum eutectic furnace software control
system is easy to operate and can directly control equipment and set various soldering process curves, and modify and create them according to different processes.
The DS series vacuum eutectic furnace is mainly designed for soldering fields with high requirements, such as military products and industrial grade high reliability products. Even nitrogen
protection or gas-phase soldering cannot meet the reliability requirements of the products. The soldering requirements for high reliability circuits in materials testing, chip packaging, power
equipment, automotive products, train control, aerospace, aviation systems, etc. must eliminate or reduce the voids and oxidation of soldering materials. Vacuum eutectic furnace is an ideal choice for
effectively reducing void rate and minimizing oxidation of solder pads or component pins. To achieve high soldering quality, a vacuum eutectic furnace must be used. This is the technological innovation
of soldering experts in the military industry of countries such as Germany, Japan, and the United States.
Industry application: The DS series vacuum eutectic furnace is an ideal choice for R&D, process research and development, material testing, and device packaging testing. It is also an ideal choice
for high-end R&D and production in military enterprises, research institutes, universities, aerospace and other fields.
Application areas: Mainly used for defect free soldering of chips and substrates, tube shells and cover plates, and producing perfect helpless solder flux soldering, such as IGBT packaging, solder paste
process, laser diode packaging process, hybrid integrated circuit packaging, tube shell cover plate packaging, MEMS and vacuum packaging.
Vacuum eutectic furnace has become an essential equipment for military enterprises, aviation, aerospace and other high-end manufacturing in developed countries such as Europe and America,
and has been widely used in fields such as chip packaging and electronic soldering
1. Real vacuum soldering environment, with a vacuum degree of up to 1Pa (rotary vane vacuum oil
pump)
2. Pressure holding rate: A soldering environment with low activity flux where the chamber vacuum is
below 25Pa within 30 minutes (pumping to 1Pa, closing the valve to start pressure holding).
3. Professional software control to achieve a perfect operating experience.
4. The programmable temperature control system with up to 40 segments in the industry can set the
most perfect process curve.
5. The temperature setting can be adjusted to create a perfect process that is closer to the soldering
material process curve.
6. Craft atmosphere: N2、HCOOH/N2, optional quality flow meter for precise control.
7. Online temperature measurement function. Accurate measurement of temperature uniformity in the
soldering area. Provide expert level support for process tuning.
8. Nitrogen or other inert gases meet the soldering requirements of special processes.
9. The maximum temperature is 450℃ (higher is optional), meeting all the requirements of soft
soldering processes.
10. Meet the demand for simultaneous heating of both upper and lower greenhouses.
1. Locking method: Automatic locking of doors through programming
2. Heating tube installation method: If selective top heating, the bottom and top are distributed at a 90
degree angle to ensure temperature uniformity, especially at the four edges of the heating plate.
3. The heating tube comes with a quartz glass, which does not affect the vacuum of the furnace
chamber when replacing the heating tube, making it convenient and fast.
4. By using a specially designed bracket to ensure that the heating tube is located in the center of the
quartz tube, the lifespan of both the quartz tube and the heating tube can be effectively extended.
5. The back of the heating tube is coated with a high-temperature layer, which can improve the
utilization rate of heat.
6. The automatic locking device of the vacuum door is made of CNC integrated processing, which
effectively improves the stability of micro positive pressure and can be used for a long time.
7. The cooling pipeline of the vacuum chamber is processed by CNC integration, eliminating the risk of
water leakage during welding of the cold water pipe in the vacuum chamber.
8. The vacuum chamber is processed with special materials, combined with 12 years of vacuum design
and process accumulation, ensuring that the configuration of the vacuum oil pump reaches 1Pa and
the vacuum oil free pump reaches 3Pa.
